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Solder Alloy 801 vs. C81500 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C81500 copper belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C81500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 22
110
Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
17
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
44
Tensile Strength: Ultimate (UTS), MPa 55
350

Thermal Properties

Latent Heat of Fusion, J/g 64
210
Melting Completion (Liquidus), °C 200
1090
Melting Onset (Solidus), °C 200
1080
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
320
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
82
Electrical Conductivity: Equal Weight (Specific), % IACS 19
83

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
2.6
Embodied Energy, MJ/kg 240
41
Embodied Water, L/kg 1140
310

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.3
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
11
Strength to Weight: Bending, points 4.4
12
Thermal Diffusivity, mm2/s 36
91
Thermal Shock Resistance, points 3.3
12

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Chromium (Cr), % 0
0.4 to 1.5
Copper (Cu), % 0 to 0.050
97.4 to 99.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 0 to 0.070
0 to 0.020
Nickel (Ni), % 0 to 0.010
0
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0 to 0.1
Zinc (Zn), % 8.5 to 9.5
0 to 0.1
Residuals, % 0
0 to 0.5