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Solder Alloy 801 vs. C82700 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C82700 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C82700 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
1.8
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 20
46
Tensile Strength: Ultimate (UTS), MPa 55
1200

Thermal Properties

Latent Heat of Fusion, J/g 64
240
Melting Completion (Liquidus), °C 200
950
Melting Onset (Solidus), °C 200
860
Specific Heat Capacity, J/kg-K 240
380
Thermal Conductivity, W/m-K 61
130
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
20
Electrical Conductivity: Equal Weight (Specific), % IACS 19
21

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.7
Embodied Carbon, kg CO2/kg material 14
12
Embodied Energy, MJ/kg 240
180
Embodied Water, L/kg 1140
310

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.8
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
38
Strength to Weight: Bending, points 4.4
29
Thermal Diffusivity, mm2/s 36
39
Thermal Shock Resistance, points 3.3
41

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.15
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Beryllium (Be), % 0
2.4 to 2.6
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Chromium (Cr), % 0
0 to 0.090
Copper (Cu), % 0 to 0.050
94.6 to 96.7
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 0 to 0.070
0 to 0.020
Nickel (Ni), % 0 to 0.010
1.0 to 1.5
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0 to 0.1
Zinc (Zn), % 8.5 to 9.5
0 to 0.1
Residuals, % 0
0 to 0.5