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Solder Alloy 801 vs. C84500 Brass

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C84500 brass belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C84500 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 22
55
Elastic (Young's, Tensile) Modulus, GPa 53
100
Elongation at Break, % 33
28
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
39
Tensile Strength: Ultimate (UTS), MPa 55
240

Thermal Properties

Latent Heat of Fusion, J/g 64
180
Melting Completion (Liquidus), °C 200
980
Melting Onset (Solidus), °C 200
840
Specific Heat Capacity, J/kg-K 240
360
Thermal Conductivity, W/m-K 61
72
Thermal Expansion, µm/m-K 22
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
16
Electrical Conductivity: Equal Weight (Specific), % IACS 19
17

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.7
Embodied Carbon, kg CO2/kg material 14
2.9
Embodied Energy, MJ/kg 240
47
Embodied Water, L/kg 1140
340

Common Calculations

Stiffness to Weight: Axial, points 4.1
6.6
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
7.7
Strength to Weight: Bending, points 4.4
9.8
Thermal Diffusivity, mm2/s 36
23
Thermal Shock Resistance, points 3.3
8.6

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0050
Antimony (Sb), % 0 to 0.1
0 to 0.25
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
77 to 79
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.4
Lead (Pb), % 0 to 0.070
6.0 to 7.5
Nickel (Ni), % 0 to 0.010
0 to 1.0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.0050
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.080
Tin (Sn), % 89.9 to 91.5
2.0 to 4.0
Zinc (Zn), % 8.5 to 9.5
10 to 14
Residuals, % 0
0 to 0.7