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Solder Alloy 801 vs. C85800 Brass

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C85800 brass belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C85800 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
100
Elongation at Break, % 33
15
Poisson's Ratio 0.35
0.31
Shear Modulus, GPa 20
40
Tensile Strength: Ultimate (UTS), MPa 55
380

Thermal Properties

Latent Heat of Fusion, J/g 64
170
Melting Completion (Liquidus), °C 200
900
Melting Onset (Solidus), °C 200
870
Specific Heat Capacity, J/kg-K 240
380
Thermal Conductivity, W/m-K 61
84
Thermal Expansion, µm/m-K 22
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
20
Electrical Conductivity: Equal Weight (Specific), % IACS 19
22

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.0
Embodied Carbon, kg CO2/kg material 14
2.8
Embodied Energy, MJ/kg 240
47
Embodied Water, L/kg 1140
330

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.2
Stiffness to Weight: Bending, points 17
20
Strength to Weight: Axial, points 2.1
13
Strength to Weight: Bending, points 4.4
15
Thermal Diffusivity, mm2/s 36
27
Thermal Shock Resistance, points 3.3
13

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.55
Antimony (Sb), % 0 to 0.1
0 to 0.050
Arsenic (As), % 0 to 0.030
0 to 0.050
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
57 to 69
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 0 to 0.070
0 to 1.5
Manganese (Mn), % 0
0 to 0.25
Nickel (Ni), % 0 to 0.010
0 to 0.5
Phosphorus (P), % 0
0 to 0.010
Silicon (Si), % 0
0 to 0.25
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.050
Tin (Sn), % 89.9 to 91.5
0 to 1.5
Zinc (Zn), % 8.5 to 9.5
31 to 41
Residuals, % 0
0 to 1.3