Solder Alloy 801 vs. C96400 Copper-nickel
Solder alloy 801 belongs to the otherwise unclassified metals classification, while C96400 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.
For each property being compared, the top bar is solder alloy 801 and the bottom bar is C96400 copper-nickel.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 53 | |
| 140 |
| Elongation at Break, % | 33 | |
| 25 |
| Poisson's Ratio | 0.35 | |
| 0.33 |
| Shear Modulus, GPa | 20 | |
| 51 |
| Tensile Strength: Ultimate (UTS), MPa | 55 | |
| 490 |
Thermal Properties
| Latent Heat of Fusion, J/g | 64 | |
| 240 |
| Melting Completion (Liquidus), °C | 200 | |
| 1240 |
| Melting Onset (Solidus), °C | 200 | |
| 1170 |
| Specific Heat Capacity, J/kg-K | 240 | |
| 400 |
| Thermal Conductivity, W/m-K | 61 | |
| 28 |
| Thermal Expansion, µm/m-K | 22 | |
| 15 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 15 | |
| 5.0 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 19 | |
| 5.1 |
Otherwise Unclassified Properties
| Density, g/cm3 | 7.2 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 14 | |
| 5.9 |
| Embodied Energy, MJ/kg | 240 | |
| 87 |
| Embodied Water, L/kg | 1140 | |
| 280 |
Common Calculations
| Stiffness to Weight: Axial, points | 4.1 | |
| 8.6 |
| Stiffness to Weight: Bending, points | 17 | |
| 19 |
| Strength to Weight: Axial, points | 2.1 | |
| 15 |
| Strength to Weight: Bending, points | 4.4 | |
| 16 |
| Thermal Diffusivity, mm2/s | 36 | |
| 7.8 |
| Thermal Shock Resistance, points | 3.3 | |
| 17 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Carbon (C), % | 0 | |
| 0 to 0.15 |
| Copper (Cu), % | 0 to 0.050 | |
| 62.3 to 71.3 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0.25 to 1.5 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 to 0.010 |
| Manganese (Mn), % | 0 | |
| 0 to 1.5 |
| Nickel (Ni), % | 0 to 0.010 | |
| 28 to 32 |
| Niobium (Nb), % | 0 | |
| 0.5 to 1.5 |
| Phosphorus (P), % | 0 | |
| 0 to 0.020 |
| Silicon (Si), % | 0 | |
| 0 to 0.5 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Sulfur (S), % | 0 | |
| 0 to 0.020 |
| Tin (Sn), % | 89.9 to 91.5 | |
| 0 |
| Zinc (Zn), % | 8.5 to 9.5 | |
| 0 |
| Residuals, % | 0 | |
| 0 to 0.5 |