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Solder Alloy 801 vs. C96800 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C96800 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C96800 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
3.4
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
46
Tensile Strength: Ultimate (UTS), MPa 55
1010

Thermal Properties

Latent Heat of Fusion, J/g 64
220
Melting Completion (Liquidus), °C 200
1120
Melting Onset (Solidus), °C 200
1060
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
52
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
10
Electrical Conductivity: Equal Weight (Specific), % IACS 19
10

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
3.4
Embodied Energy, MJ/kg 240
52
Embodied Water, L/kg 1140
300

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.6
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
32
Strength to Weight: Bending, points 4.4
25
Thermal Diffusivity, mm2/s 36
15
Thermal Shock Resistance, points 3.3
35

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0 to 0.1
0 to 0.020
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
87.1 to 90.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 0 to 0.070
0 to 0.0050
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0 to 0.010
9.5 to 10.5
Phosphorus (P), % 0
0 to 0.0050
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.0025
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0 to 1.0
Residuals, % 0
0 to 0.5