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Solder Alloy 801 vs. C99500 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C99500 copper belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C99500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
13
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
45
Tensile Strength: Ultimate (UTS), MPa 55
540

Thermal Properties

Latent Heat of Fusion, J/g 64
240
Melting Completion (Liquidus), °C 200
1090
Melting Onset (Solidus), °C 200
1040
Specific Heat Capacity, J/kg-K 240
400
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
10
Electrical Conductivity: Equal Weight (Specific), % IACS 19
10

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.7
Embodied Carbon, kg CO2/kg material 14
3.0
Embodied Energy, MJ/kg 240
47
Embodied Water, L/kg 1140
300

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.7
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
17
Strength to Weight: Bending, points 4.4
17
Thermal Shock Resistance, points 3.3
19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0.5 to 2.0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
82.5 to 92
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
3.0 to 5.0
Lead (Pb), % 0 to 0.070
0 to 0.25
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
3.5 to 5.5
Silicon (Si), % 0
0.5 to 2.0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0.5 to 2.0
Residuals, % 0
0 to 0.3