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Solder Alloy 811 vs. Grade CY40 Nickel

Solder alloy 811 belongs to the otherwise unclassified metals classification, while grade CY40 nickel belongs to the nickel alloys. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is grade CY40 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
190
Elongation at Break, % 38
34
Poisson's Ratio 0.35
0.29
Shear Modulus, GPa 19
74
Tensile Strength: Ultimate (UTS), MPa 53
540

Thermal Properties

Latent Heat of Fusion, J/g 63
330
Melting Completion (Liquidus), °C 200
1350
Melting Onset (Solidus), °C 190
1300
Specific Heat Capacity, J/kg-K 230
470
Thermal Conductivity, W/m-K 59
14
Thermal Expansion, µm/m-K 22
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
1.7
Electrical Conductivity: Equal Weight (Specific), % IACS 17
1.8

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.4
Embodied Carbon, kg CO2/kg material 14
9.1
Embodied Energy, MJ/kg 240
130
Embodied Water, L/kg 1200
260

Common Calculations

Stiffness to Weight: Axial, points 4.0
13
Stiffness to Weight: Bending, points 17
23
Strength to Weight: Axial, points 2.0
18
Strength to Weight: Bending, points 4.3
18
Thermal Diffusivity, mm2/s 35
3.7
Thermal Shock Resistance, points 3.3
16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 2.8 to 3.2
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.4
Chromium (Cr), % 0
14 to 17
Copper (Cu), % 0 to 0.050
0
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 11
Lead (Pb), % 0 to 0.070
0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0 to 0.010
67 to 86
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
0 to 3.0
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 87.8 to 89.7
0
Zinc (Zn), % 7.5 to 8.5
0