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Solder Alloy 811 vs. C10700 Copper

Solder alloy 811 belongs to the otherwise unclassified metals classification, while C10700 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is C10700 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
120
Elongation at Break, % 38
2.2 to 50
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 53
230 to 410

Thermal Properties

Latent Heat of Fusion, J/g 63
210
Melting Completion (Liquidus), °C 200
1080
Melting Onset (Solidus), °C 190
1080
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 59
390
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
100
Electrical Conductivity: Equal Weight (Specific), % IACS 17
100

Otherwise Unclassified Properties

Density, g/cm3 7.3
9.0
Embodied Carbon, kg CO2/kg material 14
2.7
Embodied Energy, MJ/kg 240
42
Embodied Water, L/kg 1200
390

Common Calculations

Stiffness to Weight: Axial, points 4.0
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.0
7.2 to 13
Strength to Weight: Bending, points 4.3
9.4 to 14
Thermal Diffusivity, mm2/s 35
110
Thermal Shock Resistance, points 3.3
8.2 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 2.8 to 3.2
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
99.83 to 99.915
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Oxygen (O), % 0
0 to 0.0010
Silver (Ag), % 0 to 0.1
0.085 to 0.12
Tin (Sn), % 87.8 to 89.7
0
Zinc (Zn), % 7.5 to 8.5
0
Residuals, % 0
0 to 0.050