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Solder Alloy 811 vs. C26200 Brass

Solder alloy 811 belongs to the otherwise unclassified metals classification, while C26200 brass belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is C26200 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
110
Elongation at Break, % 38
3.0 to 180
Poisson's Ratio 0.35
0.31
Shear Modulus, GPa 19
41
Tensile Strength: Ultimate (UTS), MPa 53
330 to 770

Thermal Properties

Latent Heat of Fusion, J/g 63
180
Melting Completion (Liquidus), °C 200
950
Melting Onset (Solidus), °C 190
920
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 59
120
Thermal Expansion, µm/m-K 22
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
28
Electrical Conductivity: Equal Weight (Specific), % IACS 17
31

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.2
Embodied Carbon, kg CO2/kg material 14
2.7
Embodied Energy, MJ/kg 240
45
Embodied Water, L/kg 1200
320

Common Calculations

Stiffness to Weight: Axial, points 4.0
7.2
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.0
11 to 26
Strength to Weight: Bending, points 4.3
13 to 23
Thermal Diffusivity, mm2/s 35
38
Thermal Shock Resistance, points 3.3
11 to 26

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 2.8 to 3.2
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
67 to 70
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.050
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 87.8 to 89.7
0
Zinc (Zn), % 7.5 to 8.5
29.6 to 33
Residuals, % 0
0 to 0.3