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Solder Alloy 811 vs. C70250 Copper

Solder alloy 811 belongs to the otherwise unclassified metals classification, while C70250 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is C70250 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
120
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 19
44
Tensile Strength: Ultimate (UTS), MPa 53
520 to 740

Thermal Properties

Latent Heat of Fusion, J/g 63
220
Melting Completion (Liquidus), °C 200
1100
Melting Onset (Solidus), °C 190
1080
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 59
170
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
36 to 50
Electrical Conductivity: Equal Weight (Specific), % IACS 17
37 to 51

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 14
2.9
Embodied Energy, MJ/kg 240
45
Embodied Water, L/kg 1200
310

Common Calculations

Stiffness to Weight: Axial, points 4.0
7.4
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.0
16 to 23
Strength to Weight: Bending, points 4.3
16 to 21
Thermal Diffusivity, mm2/s 35
49
Thermal Shock Resistance, points 3.3
18 to 26

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 2.8 to 3.2
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
92.7 to 97.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0 to 0.050
Magnesium (Mg), % 0
0.050 to 0.3
Manganese (Mn), % 0
0 to 0.1
Nickel (Ni), % 0 to 0.010
2.2 to 4.2
Silicon (Si), % 0
0.25 to 1.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 87.8 to 89.7
0
Zinc (Zn), % 7.5 to 8.5
0 to 1.0
Residuals, % 0
0 to 0.5