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Solder Alloy 811 vs. C96600 Copper

Solder alloy 811 belongs to the otherwise unclassified metals classification, while C96600 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 811 and the bottom bar is C96600 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 52
140
Elongation at Break, % 38
7.0
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 19
52
Tensile Strength: Ultimate (UTS), MPa 53
760

Thermal Properties

Latent Heat of Fusion, J/g 63
240
Melting Completion (Liquidus), °C 200
1180
Melting Onset (Solidus), °C 190
1100
Specific Heat Capacity, J/kg-K 230
400
Thermal Conductivity, W/m-K 59
30
Thermal Expansion, µm/m-K 22
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
4.0
Electrical Conductivity: Equal Weight (Specific), % IACS 17
4.1

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 14
7.0
Embodied Energy, MJ/kg 240
100
Embodied Water, L/kg 1200
280

Common Calculations

Stiffness to Weight: Axial, points 4.0
8.7
Stiffness to Weight: Bending, points 17
20
Strength to Weight: Axial, points 2.0
24
Strength to Weight: Bending, points 4.3
21
Thermal Diffusivity, mm2/s 35
8.4
Thermal Shock Resistance, points 3.3
25

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Beryllium (Be), % 0
0.4 to 0.7
Bismuth (Bi), % 2.8 to 3.2
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
63.5 to 69.8
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.8 to 1.1
Lead (Pb), % 0 to 0.070
0 to 0.010
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
29 to 33
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 87.8 to 89.7
0
Zinc (Zn), % 7.5 to 8.5
0
Residuals, % 0
0 to 0.5