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Monel K-500 vs. C99300 Copper

Monel K-500 belongs to the nickel alloys classification, while C99300 copper belongs to the copper alloys. They have 48% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is Monel K-500 and the bottom bar is C99300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
120
Elongation at Break, % 25 to 36
2.0
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 61
46
Tensile Strength: Ultimate (UTS), MPa 640 to 1100
660
Tensile Strength: Yield (Proof), MPa 310 to 880
380

Thermal Properties

Latent Heat of Fusion, J/g 270
240
Maximum Temperature: Mechanical, °C 900
250
Melting Completion (Liquidus), °C 1350
1080
Melting Onset (Solidus), °C 1320
1070
Specific Heat Capacity, J/kg-K 440
450
Thermal Conductivity, W/m-K 18
43
Thermal Expansion, µm/m-K 14
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.1
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 3.2
9.8

Otherwise Unclassified Properties

Base Metal Price, % relative 50
35
Density, g/cm3 8.7
8.2
Embodied Carbon, kg CO2/kg material 8.1
4.5
Embodied Energy, MJ/kg 120
70
Embodied Water, L/kg 280
400

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 180 to 260
11
Resilience: Unit (Modulus of Resilience), kJ/m3 300 to 2420
590
Stiffness to Weight: Axial, points 10
8.3
Stiffness to Weight: Bending, points 21
20
Strength to Weight: Axial, points 21 to 35
22
Strength to Weight: Bending, points 19 to 27
20
Thermal Diffusivity, mm2/s 4.8
12
Thermal Shock Resistance, points 21 to 36
22

Alloy Composition

Aluminum (Al), % 2.3 to 3.2
10.7 to 11.5
Carbon (C), % 0 to 0.18
0
Cobalt (Co), % 0
1.0 to 2.0
Copper (Cu), % 27 to 33
68.6 to 74.4
Iron (Fe), % 0 to 2.0
0.4 to 1.0
Lead (Pb), % 0
0 to 0.020
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 63 to 70.4
13.5 to 16.5
Silicon (Si), % 0 to 0.5
0 to 0.020
Sulfur (S), % 0 to 0.010
0
Tin (Sn), % 0
0 to 0.050
Titanium (Ti), % 0.35 to 0.85
0
Residuals, % 0
0 to 0.3