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Nickel 200 vs. Solder Alloy 111

Nickel 200 belongs to the nickel alloys classification, while solder alloy 111 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is nickel 200 and the bottom bar is solder alloy 111.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 180
33
Elongation at Break, % 23 to 44
35
Poisson's Ratio 0.31
0.4
Shear Modulus, GPa 70
12
Tensile Strength: Ultimate (UTS), MPa 420 to 540
41

Thermal Properties

Latent Heat of Fusion, J/g 290
41
Melting Completion (Liquidus), °C 1460
220
Melting Onset (Solidus), °C 1440
180
Specific Heat Capacity, J/kg-K 450
180
Thermal Conductivity, W/m-K 69
48
Thermal Expansion, µm/m-K 13
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
11
Electrical Conductivity: Equal Weight (Specific), % IACS 18
11

Otherwise Unclassified Properties

Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 11
9.4
Embodied Energy, MJ/kg 150
160
Embodied Water, L/kg 230
830

Common Calculations

Stiffness to Weight: Axial, points 11
2.0
Stiffness to Weight: Bending, points 21
12
Strength to Weight: Axial, points 13 to 17
1.2
Strength to Weight: Bending, points 14 to 17
2.8
Thermal Diffusivity, mm2/s 17
29
Thermal Shock Resistance, points 13 to 16
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 0 to 0.25
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.4
0 to 0.020
Lead (Pb), % 0
48.8 to 50.5
Manganese (Mn), % 0 to 0.35
0
Nickel (Ni), % 99 to 100
0 to 0.010
Silicon (Si), % 0 to 0.35
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.010
0
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010