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Nickel 200 vs. Solder Alloy 123

Nickel 200 belongs to the nickel alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is nickel 200 and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 180
18
Elongation at Break, % 23 to 44
45
Poisson's Ratio 0.31
0.44
Shear Modulus, GPa 70
6.2
Tensile Strength: Ultimate (UTS), MPa 420 to 540
28

Thermal Properties

Latent Heat of Fusion, J/g 290
26
Melting Completion (Liquidus), °C 1460
310
Melting Onset (Solidus), °C 1440
300
Specific Heat Capacity, J/kg-K 450
130
Thermal Conductivity, W/m-K 69
23
Thermal Expansion, µm/m-K 13
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 18
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 65
75
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 11
4.5
Embodied Energy, MJ/kg 150
74
Embodied Water, L/kg 230
500

Common Calculations

Stiffness to Weight: Axial, points 11
0.9
Stiffness to Weight: Bending, points 21
7.8
Strength to Weight: Axial, points 13 to 17
0.69
Strength to Weight: Bending, points 14 to 17
1.8
Thermal Diffusivity, mm2/s 17
16
Thermal Shock Resistance, points 13 to 16
3.8

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 0 to 0.25
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.4
0 to 0.020
Lead (Pb), % 0
93.5 to 95.5
Manganese (Mn), % 0 to 0.35
0
Nickel (Ni), % 99 to 100
0 to 0.010
Silicon (Si), % 0 to 0.35
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.010
0
Tin (Sn), % 0
4.5 to 5.5
Zinc (Zn), % 0
0 to 0.0010