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Nickel 201 vs. C12900 Copper

Nickel 201 belongs to the nickel alloys classification, while C12900 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is nickel 201 and the bottom bar is C12900 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 180
120
Elongation at Break, % 4.5 to 45
2.8 to 50
Poisson's Ratio 0.31
0.34
Shear Modulus, GPa 70
43
Shear Strength, MPa 270 to 380
150 to 210
Tensile Strength: Ultimate (UTS), MPa 390 to 660
220 to 420
Tensile Strength: Yield (Proof), MPa 80 to 510
75 to 380

Thermal Properties

Latent Heat of Fusion, J/g 290
210
Maximum Temperature: Mechanical, °C 900
200
Melting Completion (Liquidus), °C 1450
1080
Melting Onset (Solidus), °C 1440
1030
Specific Heat Capacity, J/kg-K 440
390
Thermal Conductivity, W/m-K 78
380
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 19
98
Electrical Conductivity: Equal Weight (Specific), % IACS 19
98

Otherwise Unclassified Properties

Base Metal Price, % relative 65
32
Density, g/cm3 8.9
9.0
Embodied Carbon, kg CO2/kg material 11
2.6
Embodied Energy, MJ/kg 150
41
Embodied Water, L/kg 230
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 25 to 130
11 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 17 to 720
24 to 640
Stiffness to Weight: Axial, points 11
7.2
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 12 to 20
6.8 to 13
Strength to Weight: Bending, points 13 to 19
9.1 to 14
Thermal Diffusivity, mm2/s 20
110
Thermal Shock Resistance, points 11 to 19
7.8 to 15

Alloy Composition

Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Carbon (C), % 0 to 0.020
0
Copper (Cu), % 0 to 0.25
99.88 to 100
Iron (Fe), % 0 to 0.4
0
Lead (Pb), % 0
0 to 0.0040
Manganese (Mn), % 0 to 0.35
0
Nickel (Ni), % 99 to 100
0 to 0.050
Silicon (Si), % 0 to 0.35
0
Silver (Ag), % 0
0 to 0.054
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0
0 to 0.025