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Nickel 30 vs. C70260 Copper

Nickel 30 belongs to the nickel alloys classification, while C70260 copper belongs to the copper alloys. There are 29 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is nickel 30 and the bottom bar is C70260 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 210
120
Elongation at Break, % 34
9.5 to 19
Poisson's Ratio 0.28
0.34
Shear Modulus, GPa 82
44
Shear Strength, MPa 440
320 to 450
Tensile Strength: Ultimate (UTS), MPa 660
520 to 760
Tensile Strength: Yield (Proof), MPa 270
410 to 650

Thermal Properties

Latent Heat of Fusion, J/g 320
220
Maximum Temperature: Mechanical, °C 1020
200
Melting Completion (Liquidus), °C 1480
1060
Melting Onset (Solidus), °C 1430
1040
Specific Heat Capacity, J/kg-K 450
390
Thermal Conductivity, W/m-K 10
160
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.5
40 to 50
Electrical Conductivity: Equal Weight (Specific), % IACS 1.6
40 to 51

Otherwise Unclassified Properties

Base Metal Price, % relative 60
31
Density, g/cm3 8.5
8.9
Embodied Carbon, kg CO2/kg material 9.4
2.7
Embodied Energy, MJ/kg 130
43
Embodied Water, L/kg 290
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 180
46 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 180
710 to 1810
Stiffness to Weight: Axial, points 14
7.3
Stiffness to Weight: Bending, points 23
18
Strength to Weight: Axial, points 22
16 to 24
Strength to Weight: Bending, points 20
16 to 21
Thermal Diffusivity, mm2/s 2.7
45
Thermal Shock Resistance, points 18
18 to 27

Alloy Composition

Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 28 to 31.5
0
Cobalt (Co), % 0 to 5.0
0
Copper (Cu), % 1.0 to 2.4
95.8 to 98.8
Iron (Fe), % 13 to 17
0
Manganese (Mn), % 0 to 0.030
0
Molybdenum (Mo), % 4.0 to 6.0
0
Nickel (Ni), % 30.2 to 52.2
1.0 to 3.0
Niobium (Nb), % 0.3 to 1.5
0
Phosphorus (P), % 0 to 0.040
0 to 0.010
Silicon (Si), % 0 to 0.8
0.2 to 0.7
Sulfur (S), % 0 to 0.020
0
Tungsten (W), % 1.5 to 4.0
0
Residuals, % 0
0 to 0.5