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Nickel 600 vs. Grade CW6MC Nickel

Both nickel 600 and grade CW6MC nickel are nickel alloys. They have 81% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is nickel 600 and the bottom bar is grade CW6MC nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 190
200
Elongation at Break, % 3.4 to 35
28
Fatigue Strength, MPa 220 to 300
210
Poisson's Ratio 0.29
0.29
Shear Modulus, GPa 75
79
Tensile Strength: Ultimate (UTS), MPa 650 to 990
540
Tensile Strength: Yield (Proof), MPa 270 to 760
310

Thermal Properties

Latent Heat of Fusion, J/g 310
330
Maximum Temperature: Mechanical, °C 1100
980
Melting Completion (Liquidus), °C 1410
1480
Melting Onset (Solidus), °C 1350
1430
Specific Heat Capacity, J/kg-K 460
440
Thermal Conductivity, W/m-K 14
11
Thermal Expansion, µm/m-K 13
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 1.7
1.3
Electrical Conductivity: Equal Weight (Specific), % IACS 1.8
1.4

Otherwise Unclassified Properties

Base Metal Price, % relative 55
80
Density, g/cm3 8.5
8.6
Embodied Carbon, kg CO2/kg material 9.0
14
Embodied Energy, MJ/kg 130
200
Embodied Water, L/kg 250
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 31 to 180
130
Resilience: Unit (Modulus of Resilience), kJ/m3 190 to 1490
240
Stiffness to Weight: Axial, points 13
13
Stiffness to Weight: Bending, points 23
23
Strength to Weight: Axial, points 21 to 32
18
Strength to Weight: Bending, points 20 to 26
17
Thermal Diffusivity, mm2/s 3.6
2.8
Thermal Shock Resistance, points 19 to 29
15

Alloy Composition

Carbon (C), % 0 to 0.15
0 to 0.060
Chromium (Cr), % 14 to 17
20 to 23
Copper (Cu), % 0 to 0.5
0
Iron (Fe), % 6.0 to 10
0 to 5.0
Manganese (Mn), % 0 to 1.0
0 to 1.0
Molybdenum (Mo), % 0
8.0 to 10
Nickel (Ni), % 72 to 80
55.4 to 68.9
Niobium (Nb), % 0
3.2 to 4.5
Phosphorus (P), % 0
0 to 0.015
Silicon (Si), % 0 to 0.5
0 to 1.0
Sulfur (S), % 0 to 0.015
0 to 0.030