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H01 C72500 Copper-nickel vs. H01 C72800 Copper-nickel

Both H01 C72500 copper-nickel and H01 C72800 copper-nickel are copper alloys. Both are furnished in the H01 (quarter hard) temper. They have a moderately high 93% of their average alloy composition in common. There are 25 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is H01 C72500 copper-nickel and the bottom bar is H01 C72800 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Poisson's Ratio 0.34
0.34
Rockwell B Hardness 75
89
Shear Modulus, GPa 45
44
Tensile Strength: Ultimate (UTS), MPa 450
610

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 210
200
Melting Completion (Liquidus), °C 1130
1080
Melting Onset (Solidus), °C 1060
920
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 54
55
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
11
Electrical Conductivity: Equal Weight (Specific), % IACS 11
11

Otherwise Unclassified Properties

Base Metal Price, % relative 35
38
Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 3.6
4.4
Embodied Energy, MJ/kg 55
68
Embodied Water, L/kg 320
360

Common Calculations

Stiffness to Weight: Axial, points 7.6
7.4
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 14
19
Strength to Weight: Bending, points 15
18
Thermal Diffusivity, mm2/s 16
17
Thermal Shock Resistance, points 16
22

Alloy Composition

Aluminum (Al), % 0
0 to 0.1
Antimony (Sb), % 0
0 to 0.020
Bismuth (Bi), % 0
0 to 0.0010
Boron (B), % 0
0 to 0.0010
Copper (Cu), % 85.2 to 89.7
78.3 to 82.8
Iron (Fe), % 0 to 0.6
0 to 0.5
Lead (Pb), % 0 to 0.050
0 to 0.0050
Magnesium (Mg), % 0
0.0050 to 0.15
Manganese (Mn), % 0 to 0.2
0.050 to 0.3
Nickel (Ni), % 8.5 to 10.5
9.5 to 10.5
Niobium (Nb), % 0
0.1 to 0.3
Phosphorus (P), % 0
0 to 0.0050
Silicon (Si), % 0
0 to 0.050
Sulfur (S), % 0
0 to 0.0025
Tin (Sn), % 1.8 to 2.8
7.5 to 8.5
Titanium (Ti), % 0
0 to 0.010
Zinc (Zn), % 0 to 0.5
0 to 1.0
Residuals, % 0
0 to 0.3