H08 C16500 Copper vs. H08 C26000 Brass
Both H08 C16500 copper and H08 C26000 brass are copper alloys. Both are furnished in the H08 (spring) temper. They have 70% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.
For each property being compared, the top bar is H08 C16500 copper and the bottom bar is H08 C26000 brass.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 110 | |
| 110 |
| Elongation at Break, % | 2.0 | |
| 3.0 |
| Poisson's Ratio | 0.34 | |
| 0.31 |
| Rockwell Superficial 30T Hardness | 72 | |
| 77 |
| Shear Modulus, GPa | 43 | |
| 41 |
| Shear Strength, MPa | 290 | |
| 330 |
| Tensile Strength: Ultimate (UTS), MPa | 500 | |
| 650 |
| Tensile Strength: Yield (Proof), MPa | 490 | |
| 510 |
Thermal Properties
| Latent Heat of Fusion, J/g | 210 | |
| 180 |
| Maximum Temperature: Mechanical, °C | 340 | |
| 140 |
| Melting Completion (Liquidus), °C | 1070 | |
| 950 |
| Melting Onset (Solidus), °C | 1010 | |
| 920 |
| Specific Heat Capacity, J/kg-K | 380 | |
| 390 |
| Thermal Conductivity, W/m-K | 250 | |
| 120 |
| Thermal Expansion, µm/m-K | 17 | |
| 20 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 60 | |
| 28 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 61 | |
| 31 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 31 | |
| 25 |
| Density, g/cm3 | 8.9 | |
| 8.2 |
| Embodied Carbon, kg CO2/kg material | 2.6 | |
| 2.7 |
| Embodied Energy, MJ/kg | 42 | |
| 45 |
| Embodied Water, L/kg | 320 | |
| 320 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 10 | |
| 18 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 1060 | |
| 1230 |
| Stiffness to Weight: Axial, points | 7.1 | |
| 7.2 |
| Stiffness to Weight: Bending, points | 18 | |
| 19 |
| Strength to Weight: Axial, points | 16 | |
| 22 |
| Strength to Weight: Bending, points | 16 | |
| 20 |
| Thermal Diffusivity, mm2/s | 74 | |
| 38 |
| Thermal Shock Resistance, points | 18 | |
| 22 |
Alloy Composition
| Bismuth (Bi), % | 0 | |
| 0 to 0.0059 |
| Cadmium (Cd), % | 0.6 to 1.0 | |
| 0 |
| Copper (Cu), % | 97.8 to 98.9 | |
| 68.5 to 71.5 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 0.050 |
| Lead (Pb), % | 0 | |
| 0 to 0.070 |
| Tin (Sn), % | 0.5 to 0.7 | |
| 0 |
| Zinc (Zn), % | 0 | |
| 28.1 to 31.5 |
| Residuals, % | 0 | |
| 0 to 0.3 |