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C10200 Copper vs. Solder Alloy 114

C10200 copper belongs to the copper alloys classification, while solder alloy 114 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C10200 copper and the bottom bar is solder alloy 114.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
30
Elongation at Break, % 2.6 to 50
25
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 43
11
Tensile Strength: Ultimate (UTS), MPa 230 to 410
37

Thermal Properties

Latent Heat of Fusion, J/g 210
38
Melting Completion (Liquidus), °C 1080
240
Melting Onset (Solidus), °C 1080
180
Specific Heat Capacity, J/kg-K 390
170
Thermal Conductivity, W/m-K 390
44
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
10
Electrical Conductivity: Equal Weight (Specific), % IACS 100
9.4

Otherwise Unclassified Properties

Base Metal Price, % relative 31
95
Density, g/cm3 9.0
9.7
Embodied Carbon, kg CO2/kg material 2.6
8.3
Embodied Energy, MJ/kg 41
140
Embodied Water, L/kg 310
760

Common Calculations

Stiffness to Weight: Axial, points 7.2
1.7
Stiffness to Weight: Bending, points 18
11
Strength to Weight: Axial, points 7.2 to 13
1.1
Strength to Weight: Bending, points 9.4 to 14
2.6
Thermal Diffusivity, mm2/s 110
27
Thermal Shock Resistance, points 8.2 to 15
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 99.95 to 100
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
58.4 to 60.5
Nickel (Ni), % 0
0 to 0.010
Oxygen (O), % 0 to 0.0010
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
39.5 to 40.5
Zinc (Zn), % 0
0 to 0.0010