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C10200 Copper vs. Solder Alloy 124

C10200 copper belongs to the copper alloys classification, while solder alloy 124 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C10200 copper and the bottom bar is solder alloy 124.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
17
Elongation at Break, % 2.6 to 50
46
Poisson's Ratio 0.34
0.44
Shear Modulus, GPa 43
5.8
Tensile Strength: Ultimate (UTS), MPa 230 to 410
27

Thermal Properties

Latent Heat of Fusion, J/g 210
24
Melting Completion (Liquidus), °C 1080
330
Melting Onset (Solidus), °C 1080
320
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 390
22
Thermal Expansion, µm/m-K 17
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
9.6
Electrical Conductivity: Equal Weight (Specific), % IACS 100
7.7

Otherwise Unclassified Properties

Base Metal Price, % relative 31
70
Density, g/cm3 9.0
11
Embodied Carbon, kg CO2/kg material 2.6
4.1
Embodied Energy, MJ/kg 41
68
Embodied Water, L/kg 310
470

Common Calculations

Stiffness to Weight: Axial, points 7.2
0.83
Stiffness to Weight: Bending, points 18
7.6
Strength to Weight: Axial, points 7.2 to 13
0.65
Strength to Weight: Bending, points 9.4 to 14
1.8
Thermal Diffusivity, mm2/s 110
15
Thermal Shock Resistance, points 8.2 to 15
3.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.12
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 99.95 to 100
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
97.2 to 98.2
Nickel (Ni), % 0
0 to 0.010
Oxygen (O), % 0 to 0.0010
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
1.8 to 2.2
Zinc (Zn), % 0
0 to 0.0010