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C10200 Copper vs. Solder Alloy 131

C10200 copper belongs to the copper alloys classification, while solder alloy 131 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C10200 copper and the bottom bar is solder alloy 131.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
38
Elongation at Break, % 2.6 to 50
47
Poisson's Ratio 0.34
0.39
Shear Modulus, GPa 43
14
Tensile Strength: Ultimate (UTS), MPa 230 to 410
31

Thermal Properties

Latent Heat of Fusion, J/g 210
46
Melting Completion (Liquidus), °C 1080
180
Melting Onset (Solidus), °C 1080
180
Specific Heat Capacity, J/kg-K 390
190
Thermal Conductivity, W/m-K 390
55
Thermal Expansion, µm/m-K 17
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
11
Electrical Conductivity: Equal Weight (Specific), % IACS 100
12

Otherwise Unclassified Properties

Density, g/cm3 9.0
8.8
Embodied Carbon, kg CO2/kg material 2.6
11
Embodied Energy, MJ/kg 41
180
Embodied Water, L/kg 310
940

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.4
Stiffness to Weight: Bending, points 18
13
Strength to Weight: Axial, points 7.2 to 13
1.0
Strength to Weight: Bending, points 9.4 to 14
2.5
Thermal Diffusivity, mm2/s 110
33
Thermal Shock Resistance, points 8.2 to 15
2.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0.2 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 99.95 to 100
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
35.5 to 37.3
Nickel (Ni), % 0
0 to 0.010
Oxygen (O), % 0 to 0.0010
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
62.5 to 63.5
Zinc (Zn), % 0
0 to 0.0010