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C10500 Copper vs. Solder Alloy 116

C10500 copper belongs to the copper alloys classification, while solder alloy 116 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C10500 copper and the bottom bar is solder alloy 116.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
26
Elongation at Break, % 2.8 to 51
18
Poisson's Ratio 0.34
0.42
Shear Modulus, GPa 43
9.3
Tensile Strength: Ultimate (UTS), MPa 220 to 400
34

Thermal Properties

Latent Heat of Fusion, J/g 210
34
Melting Completion (Liquidus), °C 1080
260
Melting Onset (Solidus), °C 1080
180
Specific Heat Capacity, J/kg-K 390
160
Thermal Conductivity, W/m-K 390
41
Thermal Expansion, µm/m-K 17
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
9.3
Electrical Conductivity: Equal Weight (Specific), % IACS 100
8.3

Otherwise Unclassified Properties

Base Metal Price, % relative 32
90
Density, g/cm3 9.0
10
Embodied Carbon, kg CO2/kg material 2.6
7.2
Embodied Energy, MJ/kg 42
120
Embodied Water, L/kg 350
690

Common Calculations

Stiffness to Weight: Axial, points 7.2
1.5
Stiffness to Weight: Bending, points 18
9.8
Strength to Weight: Axial, points 6.8 to 12
0.94
Strength to Weight: Bending, points 9.1 to 14
2.3
Thermal Diffusivity, mm2/s 110
26
Thermal Shock Resistance, points 7.8 to 14
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 99.89 to 99.966
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
68.4 to 70.5
Nickel (Ni), % 0
0 to 0.010
Oxygen (O), % 0 to 0.0010
0
Silver (Ag), % 0.034 to 0.060
0 to 0.1
Tin (Sn), % 0
29.5 to 30.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.050
0