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C10500 Copper vs. C82800 Copper

Both C10500 copper and C82800 copper are copper alloys. They have a very high 96% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C10500 copper and the bottom bar is C82800 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 2.8 to 51
1.0 to 20
Poisson's Ratio 0.34
0.33
Rockwell B Hardness 10 to 62
45 to 85
Shear Modulus, GPa 43
46
Tensile Strength: Ultimate (UTS), MPa 220 to 400
670 to 1140
Tensile Strength: Yield (Proof), MPa 75 to 400
380 to 1000

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
310
Melting Completion (Liquidus), °C 1080
930
Melting Onset (Solidus), °C 1080
890
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 390
120
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
18
Electrical Conductivity: Equal Weight (Specific), % IACS 100
19

Otherwise Unclassified Properties

Density, g/cm3 9.0
8.7
Embodied Carbon, kg CO2/kg material 2.6
12
Embodied Energy, MJ/kg 42
190
Embodied Water, L/kg 350
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 90
11 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 680
590 to 4080
Stiffness to Weight: Axial, points 7.2
7.8
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.8 to 12
21 to 36
Strength to Weight: Bending, points 9.1 to 14
20 to 28
Thermal Diffusivity, mm2/s 110
36
Thermal Shock Resistance, points 7.8 to 14
23 to 39

Alloy Composition

Aluminum (Al), % 0
0 to 0.15
Beryllium (Be), % 0
2.5 to 2.9
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
0.15 to 0.7
Copper (Cu), % 99.89 to 99.966
94.6 to 97.2
Iron (Fe), % 0
0 to 0.25
Lead (Pb), % 0
0 to 0.020
Nickel (Ni), % 0
0 to 0.2
Oxygen (O), % 0 to 0.0010
0
Silicon (Si), % 0
0.2 to 0.35
Silver (Ag), % 0.034 to 0.060
0
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 0
0 to 0.1
Residuals, % 0
0 to 0.5