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C11100 Copper vs. CC382H Copper-nickel

Both C11100 copper and CC382H copper-nickel are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C11100 copper and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 1.5
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 44
53
Tensile Strength: Ultimate (UTS), MPa 460
490
Tensile Strength: Yield (Proof), MPa 420
290

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 1080
1180
Melting Onset (Solidus), °C 1070
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 390
30
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 100
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 31
41
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.2
Embodied Energy, MJ/kg 41
76
Embodied Water, L/kg 310
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 6.6
85
Resilience: Unit (Modulus of Resilience), kJ/m3 750
290
Stiffness to Weight: Axial, points 7.2
8.8
Stiffness to Weight: Bending, points 18
20
Strength to Weight: Axial, points 14
15
Strength to Weight: Bending, points 15
16
Thermal Diffusivity, mm2/s 110
8.2
Thermal Shock Resistance, points 16
16

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Copper (Cu), % 99.9 to 100
62.8 to 68.4
Iron (Fe), % 0
0.5 to 1.0
Lead (Pb), % 0
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 0
29 to 32
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 0
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.1
0