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C11100 Copper vs. CC383H Copper-nickel

Both C11100 copper and CC383H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C11100 copper and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 1.5
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 44
52
Tensile Strength: Ultimate (UTS), MPa 460
490
Tensile Strength: Yield (Proof), MPa 420
260

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 1080
1180
Melting Onset (Solidus), °C 1070
1130
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 390
29
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 100
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 31
44
Density, g/cm3 9.0
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.7
Embodied Energy, MJ/kg 41
83
Embodied Water, L/kg 310
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 6.6
84
Resilience: Unit (Modulus of Resilience), kJ/m3 750
250
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 14
15
Strength to Weight: Bending, points 15
16
Thermal Diffusivity, mm2/s 110
8.1
Thermal Shock Resistance, points 16
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 99.9 to 100
64 to 69.1
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 0.5
Residuals, % 0 to 0.1
0