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C11300 Copper vs. S31266 Stainless Steel

C11300 copper belongs to the copper alloys classification, while S31266 stainless steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C11300 copper and the bottom bar is S31266 stainless steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
210
Elongation at Break, % 2.3 to 50
40
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
81
Shear Strength, MPa 160 to 240
590
Tensile Strength: Ultimate (UTS), MPa 230 to 410
860
Tensile Strength: Yield (Proof), MPa 77 to 400
470

Thermal Properties

Latent Heat of Fusion, J/g 210
310
Maximum Temperature: Mechanical, °C 200
1100
Melting Completion (Liquidus), °C 1080
1470
Melting Onset (Solidus), °C 1030
1420
Specific Heat Capacity, J/kg-K 390
460
Thermal Conductivity, W/m-K 390
12
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 100
1.8
Electrical Conductivity: Equal Weight (Specific), % IACS 100
2.0

Otherwise Unclassified Properties

Base Metal Price, % relative 32
37
Density, g/cm3 9.0
8.2
Embodied Carbon, kg CO2/kg material 2.6
6.5
Embodied Energy, MJ/kg 42
89
Embodied Water, L/kg 340
220

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 8.5 to 91
290
Resilience: Unit (Modulus of Resilience), kJ/m3 25 to 690
540
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
24
Strength to Weight: Axial, points 7.2 to 13
29
Strength to Weight: Bending, points 9.4 to 14
24
Thermal Diffusivity, mm2/s 110
3.1
Thermal Shock Resistance, points 8.2 to 15
18

Alloy Composition

Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
23 to 25
Copper (Cu), % 99.85 to 99.973
1.0 to 2.5
Iron (Fe), % 0
34.1 to 46
Manganese (Mn), % 0
2.0 to 4.0
Molybdenum (Mo), % 0
5.2 to 6.2
Nickel (Ni), % 0
21 to 24
Nitrogen (N), % 0
0.35 to 0.6
Phosphorus (P), % 0
0 to 0.035
Silicon (Si), % 0
0 to 1.0
Silver (Ag), % 0.027 to 0.050
0
Sulfur (S), % 0
0 to 0.020
Tungsten (W), % 0
1.5 to 2.5
Residuals, % 0 to 0.1
0