C12900 Copper vs. Grade M30H Nickel
C12900 copper belongs to the copper alloys classification, while grade M30H nickel belongs to the nickel alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.
For each property being compared, the top bar is C12900 copper and the bottom bar is grade M30H nickel.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 120 | |
| 160 |
| Elongation at Break, % | 2.8 to 50 | |
| 11 |
| Poisson's Ratio | 0.34 | |
| 0.32 |
| Shear Modulus, GPa | 43 | |
| 61 |
| Tensile Strength: Ultimate (UTS), MPa | 220 to 420 | |
| 770 |
| Tensile Strength: Yield (Proof), MPa | 75 to 380 | |
| 470 |
Thermal Properties
| Latent Heat of Fusion, J/g | 210 | |
| 320 |
| Maximum Temperature: Mechanical, °C | 200 | |
| 900 |
| Melting Completion (Liquidus), °C | 1080 | |
| 1250 |
| Melting Onset (Solidus), °C | 1030 | |
| 1200 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 440 |
| Thermal Conductivity, W/m-K | 380 | |
| 22 |
| Thermal Expansion, µm/m-K | 17 | |
| 13 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 98 | |
| 3.3 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 98 | |
| 3.4 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 32 | |
| 50 |
| Density, g/cm3 | 9.0 | |
| 8.6 |
| Embodied Carbon, kg CO2/kg material | 2.6 | |
| 7.7 |
| Embodied Energy, MJ/kg | 41 | |
| 110 |
| Embodied Water, L/kg | 330 | |
| 250 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 11 to 88 | |
| 75 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 24 to 640 | |
| 700 |
| Stiffness to Weight: Axial, points | 7.2 | |
| 10 |
| Stiffness to Weight: Bending, points | 18 | |
| 21 |
| Strength to Weight: Axial, points | 6.8 to 13 | |
| 25 |
| Strength to Weight: Bending, points | 9.1 to 14 | |
| 22 |
| Thermal Diffusivity, mm2/s | 110 | |
| 5.7 |
| Thermal Shock Resistance, points | 7.8 to 15 | |
| 27 |
Alloy Composition
| Antimony (Sb), % | 0 to 0.0030 | |
| 0 |
| Arsenic (As), % | 0 to 0.012 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.0030 | |
| 0 |
| Carbon (C), % | 0 | |
| 0 to 0.3 |
| Copper (Cu), % | 99.88 to 100 | |
| 27 to 33 |
| Iron (Fe), % | 0 | |
| 0 to 3.5 |
| Lead (Pb), % | 0 to 0.0040 | |
| 0 |
| Manganese (Mn), % | 0 | |
| 0 to 1.5 |
| Nickel (Ni), % | 0 to 0.050 | |
| 57.9 to 70.3 |
| Phosphorus (P), % | 0 | |
| 0 to 0.030 |
| Silicon (Si), % | 0 | |
| 2.7 to 3.7 |
| Silver (Ag), % | 0 to 0.054 | |
| 0 |
| Sulfur (S), % | 0 | |
| 0 to 0.030 |
| Tellurium (Te), % | 0 to 0.025 | |
| 0 |