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C12900 Copper vs. Solder Alloy 111

C12900 copper belongs to the copper alloys classification, while solder alloy 111 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C12900 copper and the bottom bar is solder alloy 111.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
33
Elongation at Break, % 2.8 to 50
35
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 43
12
Tensile Strength: Ultimate (UTS), MPa 220 to 420
41

Thermal Properties

Latent Heat of Fusion, J/g 210
41
Melting Completion (Liquidus), °C 1080
220
Melting Onset (Solidus), °C 1030
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 380
48
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
11
Electrical Conductivity: Equal Weight (Specific), % IACS 98
11

Otherwise Unclassified Properties

Density, g/cm3 9.0
9.3
Embodied Carbon, kg CO2/kg material 2.6
9.4
Embodied Energy, MJ/kg 41
160
Embodied Water, L/kg 330
830

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.0
Stiffness to Weight: Bending, points 18
12
Strength to Weight: Axial, points 6.8 to 13
1.2
Strength to Weight: Bending, points 9.1 to 14
2.8
Thermal Diffusivity, mm2/s 110
29
Thermal Shock Resistance, points 7.8 to 15
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0 to 0.0030
0 to 0.2
Arsenic (As), % 0 to 0.012
0 to 0.030
Bismuth (Bi), % 0 to 0.0030
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 99.88 to 100
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0 to 0.0040
48.8 to 50.5
Nickel (Ni), % 0 to 0.050
0 to 0.010
Silver (Ag), % 0 to 0.054
0 to 0.1
Tellurium (Te), % 0 to 0.025
0
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010