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C12900 Copper vs. Solder Alloy 151

C12900 copper belongs to the copper alloys classification, while solder alloy 151 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C12900 copper and the bottom bar is solder alloy 151.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
39
Elongation at Break, % 2.8 to 50
37
Poisson's Ratio 0.34
0.37
Shear Modulus, GPa 43
14
Tensile Strength: Ultimate (UTS), MPa 220 to 420
46

Thermal Properties

Latent Heat of Fusion, J/g 210
47
Melting Completion (Liquidus), °C 1080
150
Melting Onset (Solidus), °C 1030
150
Specific Heat Capacity, J/kg-K 390
190
Thermal Conductivity, W/m-K 380
44
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
10
Electrical Conductivity: Equal Weight (Specific), % IACS 98
10

Otherwise Unclassified Properties

Density, g/cm3 9.0
8.8
Embodied Carbon, kg CO2/kg material 2.6
9.2
Embodied Energy, MJ/kg 41
160
Embodied Water, L/kg 330
920

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.5
Stiffness to Weight: Bending, points 18
13
Strength to Weight: Axial, points 6.8 to 13
1.4
Strength to Weight: Bending, points 9.1 to 14
3.2
Thermal Diffusivity, mm2/s 110
26
Thermal Shock Resistance, points 7.8 to 15
3.2

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0 to 0.0030
0 to 0.2
Arsenic (As), % 0 to 0.012
0 to 0.030
Bismuth (Bi), % 0 to 0.0030
0 to 0.1
Cadmium (Cd), % 0
17.5 to 18.5
Copper (Cu), % 99.88 to 100
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0 to 0.0040
30.3 to 33
Nickel (Ni), % 0 to 0.050
0 to 0.010
Silver (Ag), % 0 to 0.054
0 to 0.1
Tellurium (Te), % 0 to 0.025
0
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010