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C14500 Copper vs. EN 1.7386 Steel

C14500 copper belongs to the copper alloys classification, while EN 1.7386 steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C14500 copper and the bottom bar is EN 1.7386 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 12 to 50
18 to 21
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
75
Shear Strength, MPa 150 to 190
340 to 410
Tensile Strength: Ultimate (UTS), MPa 220 to 330
550 to 670
Tensile Strength: Yield (Proof), MPa 69 to 260
240 to 440

Thermal Properties

Latent Heat of Fusion, J/g 210
270
Maximum Temperature: Mechanical, °C 200
600
Melting Completion (Liquidus), °C 1080
1450
Melting Onset (Solidus), °C 1050
1410
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 360
26
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 94
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 95
10

Otherwise Unclassified Properties

Base Metal Price, % relative 33
6.5
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 2.6
2.0
Embodied Energy, MJ/kg 42
28
Embodied Water, L/kg 310
88

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 36 to 85
92 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 21 to 300
150 to 490
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
25
Strength to Weight: Axial, points 6.8 to 10
20 to 24
Strength to Weight: Bending, points 9.1 to 12
19 to 22
Thermal Diffusivity, mm2/s 100
6.9
Thermal Shock Resistance, points 8.0 to 12
15 to 18

Alloy Composition

Aluminum (Al), % 0
0 to 0.040
Carbon (C), % 0
0.080 to 0.15
Chromium (Cr), % 0
8.0 to 10
Copper (Cu), % 99.2 to 99.596
0 to 0.3
Iron (Fe), % 0
86.8 to 90.5
Manganese (Mn), % 0
0.3 to 0.6
Molybdenum (Mo), % 0
0.9 to 1.1
Phosphorus (P), % 0.0040 to 0.012
0 to 0.025
Silicon (Si), % 0
0.25 to 1.0
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0.4 to 0.7
0