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C14500 Copper vs. N08024 Nickel

C14500 copper belongs to the copper alloys classification, while N08024 nickel belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C14500 copper and the bottom bar is N08024 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 12 to 50
34
Poisson's Ratio 0.34
0.28
Shear Modulus, GPa 43
79
Shear Strength, MPa 150 to 190
410
Tensile Strength: Ultimate (UTS), MPa 220 to 330
620
Tensile Strength: Yield (Proof), MPa 69 to 260
270

Thermal Properties

Latent Heat of Fusion, J/g 210
310
Maximum Temperature: Mechanical, °C 200
990
Melting Completion (Liquidus), °C 1080
1430
Melting Onset (Solidus), °C 1050
1380
Specific Heat Capacity, J/kg-K 390
460
Thermal Conductivity, W/m-K 360
12
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 94
1.6
Electrical Conductivity: Equal Weight (Specific), % IACS 95
1.8

Otherwise Unclassified Properties

Base Metal Price, % relative 33
41
Density, g/cm3 8.9
8.2
Embodied Carbon, kg CO2/kg material 2.6
7.2
Embodied Energy, MJ/kg 42
99
Embodied Water, L/kg 310
230

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 36 to 85
170
Resilience: Unit (Modulus of Resilience), kJ/m3 21 to 300
180
Stiffness to Weight: Axial, points 7.2
14
Stiffness to Weight: Bending, points 18
24
Strength to Weight: Axial, points 6.8 to 10
21
Strength to Weight: Bending, points 9.1 to 12
20
Thermal Diffusivity, mm2/s 100
3.2
Thermal Shock Resistance, points 8.0 to 12
15

Alloy Composition

Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
22.5 to 25
Copper (Cu), % 99.2 to 99.596
0.5 to 1.5
Iron (Fe), % 0
26.6 to 38.4
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
3.5 to 5.0
Nickel (Ni), % 0
35 to 40
Niobium (Nb), % 0
0.15 to 0.35
Phosphorus (P), % 0.0040 to 0.012
0 to 0.035
Silicon (Si), % 0
0 to 0.5
Sulfur (S), % 0
0 to 0.035
Tellurium (Te), % 0.4 to 0.7
0