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C15500 Copper vs. Grade M30H Nickel

C15500 copper belongs to the copper alloys classification, while grade M30H nickel belongs to the nickel alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C15500 copper and the bottom bar is grade M30H nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 3.0 to 37
11
Poisson's Ratio 0.34
0.32
Shear Modulus, GPa 43
61
Tensile Strength: Ultimate (UTS), MPa 280 to 550
770
Tensile Strength: Yield (Proof), MPa 130 to 530
470

Thermal Properties

Latent Heat of Fusion, J/g 210
320
Maximum Temperature: Mechanical, °C 200
900
Melting Completion (Liquidus), °C 1080
1250
Melting Onset (Solidus), °C 1080
1200
Specific Heat Capacity, J/kg-K 390
440
Thermal Conductivity, W/m-K 350
22
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 90
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 91
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 33
50
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 2.7
7.7
Embodied Energy, MJ/kg 42
110
Embodied Water, L/kg 360
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 15 to 84
75
Resilience: Unit (Modulus of Resilience), kJ/m3 72 to 1210
700
Stiffness to Weight: Axial, points 7.2
10
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 8.6 to 17
25
Strength to Weight: Bending, points 11 to 17
22
Thermal Diffusivity, mm2/s 100
5.7
Thermal Shock Resistance, points 9.8 to 20
27

Alloy Composition

Carbon (C), % 0
0 to 0.3
Copper (Cu), % 99.75 to 99.853
27 to 33
Iron (Fe), % 0
0 to 3.5
Magnesium (Mg), % 0.080 to 0.13
0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0
57.9 to 70.3
Phosphorus (P), % 0.040 to 0.080
0 to 0.030
Silicon (Si), % 0
2.7 to 3.7
Silver (Ag), % 0.027 to 0.1
0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.2
0