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C16500 Copper vs. CC383H Copper-nickel

Both C16500 copper and CC383H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C16500 copper and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 1.5 to 53
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
52
Tensile Strength: Ultimate (UTS), MPa 280 to 530
490
Tensile Strength: Yield (Proof), MPa 97 to 520
260

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 340
260
Melting Completion (Liquidus), °C 1070
1180
Melting Onset (Solidus), °C 1010
1130
Specific Heat Capacity, J/kg-K 380
410
Thermal Conductivity, W/m-K 250
29
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 61
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 31
44
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.7
Embodied Energy, MJ/kg 42
83
Embodied Water, L/kg 320
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 7.8 to 110
84
Resilience: Unit (Modulus of Resilience), kJ/m3 41 to 1160
250
Stiffness to Weight: Axial, points 7.1
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.6 to 17
15
Strength to Weight: Bending, points 11 to 16
16
Thermal Diffusivity, mm2/s 74
8.1
Thermal Shock Resistance, points 9.8 to 19
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0.6 to 1.0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 97.8 to 98.9
64 to 69.1
Iron (Fe), % 0 to 0.020
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 0.5 to 0.7
0
Zinc (Zn), % 0
0 to 0.5
Residuals, % 0 to 0.5
0