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C16500 Copper vs. C82000 Copper

Both C16500 copper and C82000 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C16500 copper and the bottom bar is C82000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 1.5 to 53
8.0 to 20
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
45
Tensile Strength: Ultimate (UTS), MPa 280 to 530
350 to 690
Tensile Strength: Yield (Proof), MPa 97 to 520
140 to 520

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 340
220
Melting Completion (Liquidus), °C 1070
1090
Melting Onset (Solidus), °C 1010
970
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 250
260
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
45
Electrical Conductivity: Equal Weight (Specific), % IACS 61
46

Otherwise Unclassified Properties

Base Metal Price, % relative 31
60
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.6
5.0
Embodied Energy, MJ/kg 42
77
Embodied Water, L/kg 320
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 7.8 to 110
51 to 55
Resilience: Unit (Modulus of Resilience), kJ/m3 41 to 1160
80 to 1120
Stiffness to Weight: Axial, points 7.1
7.5
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 8.6 to 17
11 to 22
Strength to Weight: Bending, points 11 to 16
12 to 20
Thermal Diffusivity, mm2/s 74
76
Thermal Shock Resistance, points 9.8 to 19
12 to 24

Alloy Composition

Aluminum (Al), % 0
0 to 0.1
Beryllium (Be), % 0
0.45 to 0.8
Cadmium (Cd), % 0.6 to 1.0
0
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
2.2 to 2.7
Copper (Cu), % 97.8 to 98.9
95.2 to 97.4
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 0
0 to 0.020
Nickel (Ni), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.15
Tin (Sn), % 0.5 to 0.7
0 to 0.1
Zinc (Zn), % 0
0 to 0.1
Residuals, % 0
0 to 0.5