MakeItFrom.com
Menu (ESC)

C16500 Copper vs. C96200 Copper-nickel

Both C16500 copper and C96200 copper-nickel are copper alloys. They have 87% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C16500 copper and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 1.5 to 53
23
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
46
Tensile Strength: Ultimate (UTS), MPa 280 to 530
350
Tensile Strength: Yield (Proof), MPa 97 to 520
190

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 340
220
Melting Completion (Liquidus), °C 1070
1150
Melting Onset (Solidus), °C 1010
1100
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 250
45
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
11
Electrical Conductivity: Equal Weight (Specific), % IACS 61
11

Otherwise Unclassified Properties

Base Metal Price, % relative 31
36
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.6
3.8
Embodied Energy, MJ/kg 42
58
Embodied Water, L/kg 320
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 7.8 to 110
68
Resilience: Unit (Modulus of Resilience), kJ/m3 41 to 1160
150
Stiffness to Weight: Axial, points 7.1
7.8
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.6 to 17
11
Strength to Weight: Bending, points 11 to 16
13
Thermal Diffusivity, mm2/s 74
13
Thermal Shock Resistance, points 9.8 to 19
12

Alloy Composition

Cadmium (Cd), % 0.6 to 1.0
0
Carbon (C), % 0
0 to 0.1
Copper (Cu), % 97.8 to 98.9
83.6 to 90
Iron (Fe), % 0 to 0.020
1.0 to 1.8
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Tin (Sn), % 0.5 to 0.7
0
Residuals, % 0
0 to 0.5