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C16500 Copper vs. N10665 Nickel

C16500 copper belongs to the copper alloys classification, while N10665 nickel belongs to the nickel alloys. There are 29 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C16500 copper and the bottom bar is N10665 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
220
Elongation at Break, % 1.5 to 53
45
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 43
84
Shear Strength, MPa 200 to 310
600
Tensile Strength: Ultimate (UTS), MPa 280 to 530
860
Tensile Strength: Yield (Proof), MPa 97 to 520
400

Thermal Properties

Latent Heat of Fusion, J/g 210
310
Maximum Temperature: Mechanical, °C 340
900
Melting Completion (Liquidus), °C 1070
1620
Melting Onset (Solidus), °C 1010
1570
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 250
11
Thermal Expansion, µm/m-K 17
10

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
1.3
Electrical Conductivity: Equal Weight (Specific), % IACS 61
1.2

Otherwise Unclassified Properties

Base Metal Price, % relative 31
75
Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 2.6
15
Embodied Energy, MJ/kg 42
200
Embodied Water, L/kg 320
270

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 7.8 to 110
320
Resilience: Unit (Modulus of Resilience), kJ/m3 41 to 1160
360
Stiffness to Weight: Axial, points 7.1
13
Stiffness to Weight: Bending, points 18
22
Strength to Weight: Axial, points 8.6 to 17
26
Strength to Weight: Bending, points 11 to 16
22
Thermal Diffusivity, mm2/s 74
3.1
Thermal Shock Resistance, points 9.8 to 19
27

Alloy Composition

Cadmium (Cd), % 0.6 to 1.0
0
Carbon (C), % 0
0 to 0.020
Chromium (Cr), % 0
0 to 1.0
Cobalt (Co), % 0
0 to 1.0
Copper (Cu), % 97.8 to 98.9
0
Iron (Fe), % 0 to 0.020
0 to 2.0
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
26 to 30
Nickel (Ni), % 0
64.8 to 74
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0
0 to 0.1
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 0.5 to 0.7
0
Residuals, % 0 to 0.5
0