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C17000 Copper vs. Grade M30C Nickel

C17000 copper belongs to the copper alloys classification, while grade M30C nickel belongs to the nickel alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 27 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C17000 copper and the bottom bar is grade M30C nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 1.1 to 31
29
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 45
61
Tensile Strength: Ultimate (UTS), MPa 490 to 1310
510
Tensile Strength: Yield (Proof), MPa 160 to 1140
250

Thermal Properties

Latent Heat of Fusion, J/g 230
290
Maximum Temperature: Mechanical, °C 270
900
Melting Completion (Liquidus), °C 980
1290
Melting Onset (Solidus), °C 870
1240
Specific Heat Capacity, J/kg-K 390
430
Thermal Conductivity, W/m-K 110
22
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 22
3.4

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.8
Embodied Carbon, kg CO2/kg material 8.7
9.5
Embodied Energy, MJ/kg 140
140
Embodied Water, L/kg 310
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 4.2 to 390
120
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5420
200
Stiffness to Weight: Axial, points 7.6
10
Stiffness to Weight: Bending, points 19
21
Strength to Weight: Axial, points 15 to 41
16
Strength to Weight: Bending, points 16 to 30
16
Thermal Diffusivity, mm2/s 32
5.7
Thermal Shock Resistance, points 17 to 45
18

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.6 to 1.8
0
Carbon (C), % 0
0 to 0.3
Copper (Cu), % 96.3 to 98.2
26 to 33
Iron (Fe), % 0 to 0.4
0 to 3.5
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0.2 to 0.6
56.6 to 72
Niobium (Nb), % 0
1.0 to 3.0
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0 to 0.2
1.0 to 2.0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0