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C17200 Copper vs. EN 1.5501 Steel

C17200 copper belongs to the copper alloys classification, while EN 1.5501 steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C17200 copper and the bottom bar is EN 1.5501 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 1.1 to 37
12 to 17
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 45
73
Shear Strength, MPa 330 to 780
270 to 310
Tensile Strength: Ultimate (UTS), MPa 480 to 1380
390 to 510
Tensile Strength: Yield (Proof), MPa 160 to 1250
260 to 420

Thermal Properties

Latent Heat of Fusion, J/g 230
250
Maximum Temperature: Mechanical, °C 280
400
Melting Completion (Liquidus), °C 980
1460
Melting Onset (Solidus), °C 870
1420
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 110
52
Thermal Expansion, µm/m-K 18
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
7.0
Electrical Conductivity: Equal Weight (Specific), % IACS 23
8.1

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.9
Embodied Carbon, kg CO2/kg material 9.4
1.4
Embodied Energy, MJ/kg 150
18
Embodied Water, L/kg 310
46

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 4.2 to 500
40 to 83
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5720
190 to 460
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 15 to 44
14 to 18
Strength to Weight: Bending, points 16 to 31
15 to 18
Thermal Diffusivity, mm2/s 31
14
Thermal Shock Resistance, points 16 to 46
11 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Boron (B), % 0
0.00080 to 0.0050
Carbon (C), % 0
0.13 to 0.16
Copper (Cu), % 96.1 to 98
0 to 0.25
Iron (Fe), % 0 to 0.4
98.4 to 99.269
Manganese (Mn), % 0
0.6 to 0.8
Nickel (Ni), % 0.2 to 0.6
0
Phosphorus (P), % 0
0 to 0.025
Silicon (Si), % 0 to 0.2
0 to 0.3
Sulfur (S), % 0
0 to 0.025
Residuals, % 0 to 0.5
0