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C17200 Copper vs. EN 1.5503 Steel

C17200 copper belongs to the copper alloys classification, while EN 1.5503 steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C17200 copper and the bottom bar is EN 1.5503 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 1.1 to 37
12 to 17
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 45
73
Shear Strength, MPa 330 to 780
270 to 320
Tensile Strength: Ultimate (UTS), MPa 480 to 1380
400 to 520
Tensile Strength: Yield (Proof), MPa 160 to 1250
270 to 430

Thermal Properties

Latent Heat of Fusion, J/g 230
250
Maximum Temperature: Mechanical, °C 280
400
Melting Completion (Liquidus), °C 980
1460
Melting Onset (Solidus), °C 870
1420
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 110
52
Thermal Expansion, µm/m-K 18
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
7.0
Electrical Conductivity: Equal Weight (Specific), % IACS 23
8.1

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.8
Embodied Carbon, kg CO2/kg material 9.4
1.4
Embodied Energy, MJ/kg 150
18
Embodied Water, L/kg 310
46

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 4.2 to 500
41 to 81
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5720
200 to 490
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 15 to 44
14 to 19
Strength to Weight: Bending, points 16 to 31
15 to 18
Thermal Diffusivity, mm2/s 31
14
Thermal Shock Resistance, points 16 to 46
12 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Boron (B), % 0
0.00080 to 0.0050
Carbon (C), % 0
0.16 to 0.2
Copper (Cu), % 96.1 to 98
0 to 0.25
Iron (Fe), % 0 to 0.4
98.4 to 99.239
Manganese (Mn), % 0
0.6 to 0.8
Nickel (Ni), % 0.2 to 0.6
0
Phosphorus (P), % 0
0 to 0.025
Silicon (Si), % 0 to 0.2
0 to 0.3
Sulfur (S), % 0
0 to 0.025
Residuals, % 0 to 0.5
0