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C17200 Copper vs. EN 1.5525 Steel

C17200 copper belongs to the copper alloys classification, while EN 1.5525 steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C17200 copper and the bottom bar is EN 1.5525 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 1.1 to 37
11 to 21
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 45
73
Shear Strength, MPa 330 to 780
310 to 350
Tensile Strength: Ultimate (UTS), MPa 480 to 1380
440 to 1440
Tensile Strength: Yield (Proof), MPa 160 to 1250
300 to 490

Thermal Properties

Latent Heat of Fusion, J/g 230
250
Maximum Temperature: Mechanical, °C 280
400
Melting Completion (Liquidus), °C 980
1460
Melting Onset (Solidus), °C 870
1420
Specific Heat Capacity, J/kg-K 390
470
Thermal Conductivity, W/m-K 110
50
Thermal Expansion, µm/m-K 18
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
7.1
Electrical Conductivity: Equal Weight (Specific), % IACS 23
8.2

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.8
Embodied Carbon, kg CO2/kg material 9.4
1.4
Embodied Energy, MJ/kg 150
19
Embodied Water, L/kg 310
48

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 4.2 to 500
44 to 240
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5720
240 to 640
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 15 to 44
16 to 51
Strength to Weight: Bending, points 16 to 31
16 to 36
Thermal Diffusivity, mm2/s 31
13
Thermal Shock Resistance, points 16 to 46
13 to 42

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Boron (B), % 0
0.00080 to 0.0050
Carbon (C), % 0
0.18 to 0.23
Chromium (Cr), % 0
0 to 0.3
Copper (Cu), % 96.1 to 98
0 to 0.25
Iron (Fe), % 0 to 0.4
97.7 to 98.9
Manganese (Mn), % 0
0.9 to 1.2
Nickel (Ni), % 0.2 to 0.6
0
Phosphorus (P), % 0
0 to 0.025
Silicon (Si), % 0 to 0.2
0 to 0.3
Sulfur (S), % 0
0 to 0.025
Residuals, % 0 to 0.5
0