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C17300 Copper vs. ASTM A369 Grade FP9

C17300 copper belongs to the copper alloys classification, while ASTM A369 grade FP9 belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is ASTM A369 grade FP9.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 3.0 to 23
20
Poisson's Ratio 0.33
0.28
Shear Modulus, GPa 45
75
Shear Strength, MPa 320 to 790
300
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
470
Tensile Strength: Yield (Proof), MPa 160 to 1200
240

Thermal Properties

Latent Heat of Fusion, J/g 230
270
Maximum Temperature: Mechanical, °C 270
600
Melting Completion (Liquidus), °C 980
1450
Melting Onset (Solidus), °C 870
1410
Specific Heat Capacity, J/kg-K 380
480
Thermal Conductivity, W/m-K 110
26
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 23
10

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.8
Embodied Carbon, kg CO2/kg material 9.4
2.0
Embodied Energy, MJ/kg 150
28
Embodied Water, L/kg 310
87

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
80
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
140
Stiffness to Weight: Axial, points 7.6
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 16 to 44
17
Strength to Weight: Bending, points 16 to 31
17
Thermal Diffusivity, mm2/s 32
6.9
Thermal Shock Resistance, points 17 to 48
13

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0 to 0.15
Chromium (Cr), % 0
8.0 to 10
Copper (Cu), % 95.5 to 97.8
0
Iron (Fe), % 0 to 0.4
87.1 to 90.3
Lead (Pb), % 0.2 to 0.6
0
Manganese (Mn), % 0
0.3 to 0.6
Molybdenum (Mo), % 0
0.9 to 1.1
Nickel (Ni), % 0.2 to 0.6
0
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0 to 0.2
0.5 to 1.0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0