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C17300 Copper vs. EN 1.0214 Steel

C17300 copper belongs to the copper alloys classification, while EN 1.0214 steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is EN 1.0214 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 3.0 to 23
12 to 31
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 45
73
Shear Strength, MPa 320 to 790
250 to 290
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
330 to 460
Tensile Strength: Yield (Proof), MPa 160 to 1200
210 to 360

Thermal Properties

Latent Heat of Fusion, J/g 230
250
Maximum Temperature: Mechanical, °C 270
400
Melting Completion (Liquidus), °C 980
1470
Melting Onset (Solidus), °C 870
1420
Specific Heat Capacity, J/kg-K 380
470
Thermal Conductivity, W/m-K 110
53
Thermal Expansion, µm/m-K 17
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
6.9
Electrical Conductivity: Equal Weight (Specific), % IACS 23
7.9

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.9
Embodied Carbon, kg CO2/kg material 9.4
1.4
Embodied Energy, MJ/kg 150
18
Embodied Water, L/kg 310
46

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
34 to 130
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
120 to 340
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 16 to 44
12 to 16
Strength to Weight: Bending, points 16 to 31
14 to 17
Thermal Diffusivity, mm2/s 32
14
Thermal Shock Resistance, points 17 to 48
11 to 14

Alloy Composition

Aluminum (Al), % 0 to 0.2
0.020 to 0.060
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0.080 to 0.12
Copper (Cu), % 95.5 to 97.8
0
Iron (Fe), % 0 to 0.4
99.17 to 99.6
Lead (Pb), % 0.2 to 0.6
0
Manganese (Mn), % 0
0.3 to 0.5
Nickel (Ni), % 0.2 to 0.6
0
Phosphorus (P), % 0
0 to 0.025
Silicon (Si), % 0 to 0.2
0 to 0.1
Sulfur (S), % 0
0 to 0.025
Residuals, % 0 to 0.5
0