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C17300 Copper vs. EN 1.0434 Steel

C17300 copper belongs to the copper alloys classification, while EN 1.0434 steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is EN 1.0434 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 3.0 to 23
12 to 28
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 45
73
Shear Strength, MPa 320 to 790
280 to 330
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
390 to 540
Tensile Strength: Yield (Proof), MPa 160 to 1200
250 to 450

Thermal Properties

Latent Heat of Fusion, J/g 230
250
Maximum Temperature: Mechanical, °C 270
400
Melting Completion (Liquidus), °C 980
1460
Melting Onset (Solidus), °C 870
1420
Specific Heat Capacity, J/kg-K 380
470
Thermal Conductivity, W/m-K 110
52
Thermal Expansion, µm/m-K 17
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
7.0
Electrical Conductivity: Equal Weight (Specific), % IACS 23
8.0

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.9
Embodied Carbon, kg CO2/kg material 9.4
1.4
Embodied Energy, MJ/kg 150
18
Embodied Water, L/kg 310
46

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
39 to 140
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
170 to 540
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 16 to 44
14 to 19
Strength to Weight: Bending, points 16 to 31
15 to 19
Thermal Diffusivity, mm2/s 32
14
Thermal Shock Resistance, points 17 to 48
12 to 17

Alloy Composition

Aluminum (Al), % 0 to 0.2
0.020 to 0.060
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0.15 to 0.19
Copper (Cu), % 95.5 to 97.8
0
Iron (Fe), % 0 to 0.4
98.8 to 99.18
Lead (Pb), % 0.2 to 0.6
0
Manganese (Mn), % 0
0.65 to 0.85
Nickel (Ni), % 0.2 to 0.6
0
Phosphorus (P), % 0
0 to 0.025
Silicon (Si), % 0 to 0.2
0 to 0.1
Sulfur (S), % 0
0 to 0.025
Residuals, % 0 to 0.5
0