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C17300 Copper vs. Solder Alloy 181

C17300 copper belongs to the copper alloys classification, while solder alloy 181 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is solder alloy 181.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
18
Elongation at Break, % 3.0 to 23
41
Poisson's Ratio 0.33
0.44
Shear Modulus, GPa 45
6.1
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
27

Thermal Properties

Latent Heat of Fusion, J/g 230
26
Melting Completion (Liquidus), °C 980
310
Melting Onset (Solidus), °C 870
300
Specific Heat Capacity, J/kg-K 380
130
Thermal Conductivity, W/m-K 110
24
Thermal Expansion, µm/m-K 17
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
9.3
Electrical Conductivity: Equal Weight (Specific), % IACS 23
7.4

Otherwise Unclassified Properties

Density, g/cm3 8.8
11
Embodied Carbon, kg CO2/kg material 9.4
6.2
Embodied Energy, MJ/kg 150
100

Common Calculations

Stiffness to Weight: Axial, points 7.6
0.86
Stiffness to Weight: Bending, points 19
7.7
Strength to Weight: Axial, points 16 to 44
0.66
Strength to Weight: Bending, points 16 to 31
1.8
Thermal Diffusivity, mm2/s 32
16
Thermal Shock Resistance, points 17 to 48
3.8

Alloy Composition

Aluminum (Al), % 0 to 0.2
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 1.8 to 2.0
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 95.5 to 97.8
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.4
0 to 0.020
Lead (Pb), % 0.2 to 0.6
96.2 to 98
Nickel (Ni), % 0.2 to 0.6
0 to 0.010
Silicon (Si), % 0 to 0.2
0
Silver (Ag), % 0
2.0 to 3.0
Tin (Sn), % 0
0 to 0.25
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0