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C17300 Copper vs. Solder Alloy 503

C17300 copper belongs to the copper alloys classification, while solder alloy 503 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is solder alloy 503.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
54
Elongation at Break, % 3.0 to 23
30
Poisson's Ratio 0.33
0.36
Shear Modulus, GPa 45
20
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
57

Thermal Properties

Latent Heat of Fusion, J/g 230
69
Melting Completion (Liquidus), °C 980
380
Melting Onset (Solidus), °C 870
220
Specific Heat Capacity, J/kg-K 380
230
Thermal Conductivity, W/m-K 110
61
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
14
Electrical Conductivity: Equal Weight (Specific), % IACS 23
17

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.5
Embodied Carbon, kg CO2/kg material 9.4
16
Embodied Energy, MJ/kg 150
270

Common Calculations

Stiffness to Weight: Axial, points 7.6
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 16 to 44
2.1
Strength to Weight: Bending, points 16 to 31
4.4
Thermal Diffusivity, mm2/s 32
35
Thermal Shock Resistance, points 17 to 48
3.5

Alloy Composition

Aluminum (Al), % 0 to 0.2
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 1.8 to 2.0
0
Bismuth (Bi), % 0
0 to 0.080
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 95.5 to 97.8
5.5 to 6.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.4
0 to 0.020
Lead (Pb), % 0.2 to 0.6
0 to 0.070
Nickel (Ni), % 0.2 to 0.6
0 to 0.010
Silicon (Si), % 0 to 0.2
0
Silver (Ag), % 0
1.8 to 2.2
Tin (Sn), % 0
90.8 to 92.7
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0