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C17300 Copper vs. C12900 Copper

Both C17300 copper and C12900 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is C12900 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 3.0 to 23
2.8 to 50
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 45
43
Shear Strength, MPa 320 to 790
150 to 210
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
220 to 420
Tensile Strength: Yield (Proof), MPa 160 to 1200
75 to 380

Thermal Properties

Latent Heat of Fusion, J/g 230
210
Maximum Temperature: Mechanical, °C 270
200
Melting Completion (Liquidus), °C 980
1080
Melting Onset (Solidus), °C 870
1030
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 110
380
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
98
Electrical Conductivity: Equal Weight (Specific), % IACS 23
98

Otherwise Unclassified Properties

Density, g/cm3 8.8
9.0
Embodied Carbon, kg CO2/kg material 9.4
2.6
Embodied Energy, MJ/kg 150
41
Embodied Water, L/kg 310
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
11 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
24 to 640
Stiffness to Weight: Axial, points 7.6
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 16 to 44
6.8 to 13
Strength to Weight: Bending, points 16 to 31
9.1 to 14
Thermal Diffusivity, mm2/s 32
110
Thermal Shock Resistance, points 17 to 48
7.8 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Beryllium (Be), % 1.8 to 2.0
0
Bismuth (Bi), % 0
0 to 0.0030
Copper (Cu), % 95.5 to 97.8
99.88 to 100
Iron (Fe), % 0 to 0.4
0
Lead (Pb), % 0.2 to 0.6
0 to 0.0040
Nickel (Ni), % 0.2 to 0.6
0 to 0.050
Silicon (Si), % 0 to 0.2
0
Silver (Ag), % 0
0 to 0.054
Tellurium (Te), % 0
0 to 0.025
Residuals, % 0 to 0.5
0