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C17300 Copper vs. C73100 Nickel Silver

Both C17300 copper and C73100 nickel silver are copper alloys. They have 75% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is C73100 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 3.0 to 23
3.4 to 8.0
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 45
43
Shear Strength, MPa 320 to 790
260 to 370
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
450 to 640
Tensile Strength: Yield (Proof), MPa 160 to 1200
420 to 590

Thermal Properties

Latent Heat of Fusion, J/g 230
190
Maximum Temperature: Mechanical, °C 270
170
Melting Completion (Liquidus), °C 980
1030
Melting Onset (Solidus), °C 870
1000
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 110
35
Thermal Expansion, µm/m-K 17
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
7.5
Electrical Conductivity: Equal Weight (Specific), % IACS 23
8.0

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.4
Embodied Carbon, kg CO2/kg material 9.4
3.0
Embodied Energy, MJ/kg 150
49
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
21 to 35
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
790 to 1560
Stiffness to Weight: Axial, points 7.6
7.5
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 16 to 44
15 to 21
Strength to Weight: Bending, points 16 to 31
15 to 20
Thermal Diffusivity, mm2/s 32
11
Thermal Shock Resistance, points 17 to 48
15 to 21

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Copper (Cu), % 95.5 to 97.8
70.8 to 78
Iron (Fe), % 0 to 0.4
0 to 0.1
Lead (Pb), % 0.2 to 0.6
0 to 0.050
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0.2 to 0.6
4.0 to 6.0
Silicon (Si), % 0 to 0.2
0
Tin (Sn), % 0
0 to 0.1
Zinc (Zn), % 0
18 to 22
Residuals, % 0
0 to 0.5