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C17300 Copper vs. C96300 Copper-nickel

Both C17300 copper and C96300 copper-nickel are copper alloys. They have 78% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Elongation at Break, % 3.0 to 23
11
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 45
49
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
580
Tensile Strength: Yield (Proof), MPa 160 to 1200
430

Thermal Properties

Latent Heat of Fusion, J/g 230
230
Maximum Temperature: Mechanical, °C 270
240
Melting Completion (Liquidus), °C 980
1200
Melting Onset (Solidus), °C 870
1150
Specific Heat Capacity, J/kg-K 380
400
Thermal Conductivity, W/m-K 110
37
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 23
6.1

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 9.4
5.1
Embodied Energy, MJ/kg 150
76
Embodied Water, L/kg 310
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
59
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
720
Stiffness to Weight: Axial, points 7.6
8.2
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 16 to 44
18
Strength to Weight: Bending, points 16 to 31
17
Thermal Diffusivity, mm2/s 32
10
Thermal Shock Resistance, points 17 to 48
20

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 95.5 to 97.8
72.3 to 80.8
Iron (Fe), % 0 to 0.4
0.5 to 1.5
Lead (Pb), % 0.2 to 0.6
0 to 0.010
Manganese (Mn), % 0
0.25 to 1.5
Nickel (Ni), % 0.2 to 0.6
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0 to 0.2
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Residuals, % 0
0 to 0.5